This is 112.5 mW per link or 11.25 mW/Gbit/s/link. 1350 mW for the bi-directional 12-channel 10 Gbit/s/ch optical link (Tx+Rx). With the chip set used in the test vehicle, the power consumption is approx. Efficient light in/out coupling structures including integrated and embedded 45° mirrors are characterized to meet the target link budget of 10-15 dB at 5-10 Gbps data rate with bit-error-rate (BER) of 10-12.
Low-loss acrylate-based waveguides (~0.0 5dB/cm at 850 nm) are used for OFPCs. Characterization results are given on optical waveguides, I/O couplers, transceiver units, thermal simulations and on selected life-time performance and reliability tests. This paper describes design and fabrication of OE-R/F HDI engine boards with flexible optical interconnect FPCs (OE-FPC) optical coupling methods chip embedding and assembly procedures optical engines with 850-nm vertical cavity surface emitting lasers, photo-detectors, and multichannel integrated ICs. In this study, flexible and rigid-flex optical electrical circuit boards are used in product emulator designed for in-device optical data links with aggregate data rate up to 120 Gbps (12-ch × 10 Gbps). The module utilizes flexible optical waveguides on electrical printed circuit board for data links between high-speed interface devices, such as application processor-to-camera or display module. In this paper, we present active optical flex module aimed for mobile device applications.
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